Overview
The Thermalright LGA 1700 CPU Contact Frame V2 (sold in Japan as Thermalright LGA 1700 CPUコンタクトフレームV2) is an aluminum bracket that fully replaces the stock ILM (Independent Loading Mechanism) on Intel's LGA1700 socket. It does exactly one thing: it redistributes clamping force to the four corners so the integrated heat spreader stops dishing inward at the center.
The frame weighs about 20g and ships with nothing but itself and an L-shaped driver.
The honest framing is this: it does not raise the ceiling of your CPU cooler. It recovers the performance your existing cooler should already be delivering.
If you run a 12th Gen (Alder Lake), 13th Gen (Raptor Lake), or 14th Gen (Raptor Lake Refresh) chip and your temperatures look wrong for the cooler you paid for, you will likely feel the difference. If temperatures are already comfortable, you probably will not.
As captured on 2026-08-29, the Japanese listing showed ¥3,671, with an overseas marketplace listing at $11.75 (captured 2026-08-28).Check the retailer's page for the latest user reviews.
All prices are point-in-time values and move with sales and exchange rates, so confirm the current figure on the product page.
Why LGA1700 CPUs Bend
LGA1700 stretched the socket into a longer rectangle compared with LGA1200, while the stock ILM still presses down from a limited number of points. The load ends up biased along the long axis, and the IHS deforms slightly inward at the center.
Reported deflection is small, in the range of tens of microns up to roughly 0.1mm, but thermal paste layers normally operate around 0.05mm, so that small number directly shapes contact quality.
The easiest way to check your own build is the paste pattern when you remove the cooler. Paste that stays thick in the middle and thin at the corners (or the reverse) means the two flat surfaces are not actually meeting.
A second symptom is a temperature plateau: you moved to a dual-tower air cooler or a 240mm AIO and almost nothing changed. Either sign makes this a high-value ¥3,671.
Note that Intel's official position is that this deflection is within spec and does not affect performance. Removing the stock ILM is done at your own risk and may weaken your warranty position.
Compatibility Guide
| Item | Detail |
|---|---|
| Socket | Intel LGA1700 only |
| CPU generations | 12th Gen (Alder Lake) / 13th Gen (Raptor Lake) / 14th Gen (Raptor Lake Refresh) |
| Chipsets | H610, B660, B760, Z690, Z790 and other LGA1700 boards |
| Material | Aluminum alloy, CNC machined, gold anodized |
| Weight | About 20g |
| In the box | Frame x1, L-shaped driver x1 |
The frame replaces the motherboard's ILM, not your cooler's mounting bracket, and the rear backplate stays in place. Most coolers therefore carry over unchanged.
Four things still trip people up.
First, coolers whose mounting hardware straddles the ILM perimeter can sit differently once the frame is installed, so check clearance. Second, boards with tall VRM heatsinks or capacitors right next to the socket, especially mini-ITX, can be tight enough that getting a driver to the corner screws is awkward.
Third, close-in M.2 heatsinks and the first DIMM slot make the job cramped.
Look at photos of your socket area before ordering.
Fourth, know what it will not fit. LGA1200, AM4, and AM5 are out, and so is the newer LGA1851.
Laptops with soldered (BGA) CPUs are not applicable. Listings for different generations sit side by side, so confirm both LGA1700 and V2 at checkout.
Product Info
Construction is CNC-machined aluminum alloy with a gold anodized finish, roughly 20g, with the frame, its screws, and one L-shaped driver making up the entire package. Not needing to buy a separate tool is a genuine practical advantage here.
Check the retailer's page for the latest price. The gap is not a like-for-like comparison once shipping, duties, delivery time, and authenticity checks are factored in.
Judge the price against the alternative, which is buying a new cooler in the several-thousand-yen to twenty-thousand-yen range. If contact is the bottleneck, a better cooler will underdeliver, so fixing contact first can be the rational order of operations.
V2 is the revised version of the original frame, generally described as arriving around 2024; check the listing for exact release information.
Installation and Common Mistakes
The sequence: power down and unplug, remove the cooler, clean the paste off the IHS, open the stock ILM lever and lift the CPU out, unscrew and remove the ILM, seat the CPU with the triangle marker aligned, fit the frame and tighten diagonally in small increments, then reapply paste and remount the cooler.
Four mistakes dominate. You will need thermal paste, so order it alongside the frame or you will stall mid-job.
Do not overtighten: the bundled driver has no torque control, so go diagonally and stop when resistance builds. Keep the removed ILM and its screws if you might sell the CPU or return it.
And treat the exposed socket pins as untouchable while the ILM is off. Experienced builders finish in five minutes; budget 20-30 minutes for a first attempt including cleanup.
How Much Improvement to Expect
Reports cluster in the 3-10°C range. That spread reflects starting conditions more than luck.
A badly bent sample paired with a large cooler under sustained all-core load (encoding, compiling, rendering) lands at the top. A mildly bent sample under mid-level gaming load may only show 1-2°C, which is within measurement noise.
To measure honestly, run the same workload at the same ambient temperature and fan curve for ten minutes before installing, and record average and peak core temperatures plus whether thermal limits are clipping clocks. Idle comparisons tell you almost nothing, because at low heat output the paste layer barely matters.
Alternatives Compared
The free option is the washer mod, shimming the stock ILM screws to reduce clamping depth. It works by reducing force, which brings its own risks to contact pressure and CPU retention.
A contact frame instead redirects the load, so the reasoning is different. Upgrading paste can buy a few degrees but never addresses an uneven surface.
Liquid metal offers more, with leakage and corrosion risk attached. Doing nothing is also defensible: if you game and temperatures are fine, Intel's own position says this is normal operation.
Recommended Users
- Owners of 12th-14th Gen chips whose large cooler has plateaued on temperature
- Overclockers and anyone running sustained all-core workloads
- Quiet-build enthusiasts, since lower temperatures let fans spin slower
- Anyone who has seen an obviously uneven paste pattern on removal
- Builders who repaste regularly, where this adds almost no extra work
It is a poor fit for non-LGA1700 sockets (LGA1200, LGA1851, AM4, AM5), for gaming rigs already sitting in the 80°C range, for anyone uneasy about reseating a CPU, for warranty-first owners, and for cramped mini-ITX boards where clearance is unclear.
Before You Buy
The headline caveat is that this is a self-responsibility modification. Removing the stock ILM is outside Intel's intended use, and overtightening can damage the board or CPU.
Tighten diagonally, stop when it firms up, and skip the product entirely if that discipline is not realistic for you.
Clearance comes next. VRM heatsinks, capacitors, M.2 heatsinks, and some cooler brackets were all designed around the stock ILM.
Discovering mid-install that a tool will not reach a corner screw means a stalled build, so review your socket layout first.
A common misconception is that the frame raises cooling capacity. It improves contact quality, not the cooler's heat dissipation ceiling.
If your cooler is simply undersized, this will not close that gap. Factor in the cost of paste and the time involved as well.
Finally, listing metadata (manufacturer, model number, supported generations) occasionally carries details from a different product. LGA1700 and LGA1851 versions, plus V1 and V2, are sold side by side, so verify the target product and generation using the product image and title.
Treat unusually cheap overseas listings with caution regarding shipping, duties, and authenticity.
FAQ
Q: Is installation difficult? A: The steps are simple and take about five minutes once familiar.
But you must reseat the CPU and reapply paste, so allow 20-30 minutes the first time.
Q: Does it work on every LGA1700 motherboard? A: Generally yes across H610, B660, B760, Z690, and Z790.
Some boards have components near the socket, and some cooler brackets have been reported to interfere, so check your layout.
Q: How much of a temperature drop should I expect? A: Most reports fall between 3°C and 10°C.
Original bend severity, cooler type, and workload drive the result, and some builds see only 1-2°C.
Q: Do I need new thermal paste?
A: Yes, mandatory. Removing the CPU means cleaning and reapplying paste, so have some on hand.
Q: Can I go back to the stock ILM?
A: Yes, if you keep the removed ILM and its screws together. Worth doing if you plan to resell the CPU.
Q: Will my game frame rates improve? A: Only if thermal limits were clipping your clocks.
Otherwise expect lower temperatures and quieter fans rather than higher fps.





